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Global Radiation-Hardened Electronics Market Size, Trends & Growth Opportunity, By Component (Microprocessor, Memory, FPGA, and Sensors), By Application (Space, Aerospace & Defense, and Nuclear Power Plants) By Region and Forecast till 2027.


Report ID : IR1001149 | Industries : Healthcare | Published On :May 2024 | Page Count : 234

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  • Global Radiation-Hardened Electronics Market Size, Trends & Growth Opportunity, By Component (Microprocessor, Memory, FPGA, and Sensors), By Application (Space, Aerospace & Defense, and Nuclear Power Plants) By Region and Forecast till 2027.
    Global Radiation-Hardened Electronics Market 
    The Global Radiation-Hardened Electronics Market is expected to grow from US$ 1.01 Billion in 2021 to US$ 2.03 Billion by 2027; it is estimated to grow at a CAGR of 12.34% from 2022 to 2027.

    Market Overview

    Radiation hardening is defined as the act of manufacturing electronic components and can withstand the damage caused by ionizing radiation such as particle radiation, and high energy electromagnetic radiation. These products are classically tested one or more resultant effect tests, including total ionizing dose, enhanced low dose rate effects, and single event effects.

    Market Drivers

    Increase in global intelligence, surveillance & reconnaissance operations is the key driving factor which is expected to boost the global radiation-hardened electronics market growth. Furthermore, increase in advancements in FPGA & multicore processor technologies for defense and space applications will have the positive impact on market growth. Moreover, increase in research and development activities across the globe will propel the market growth. In addition to that, growing requirements for reconfigurable Rad-Hard Components will drive the market growth.

    Market Restraints

    However, high costs of development and design is the major restraining factor which is expected to hinder the global radiation-hardened electronics market growth. Also, difficulties in creating actual testing environment will affect the market growth.

    Market Opportunity

    Global demand for advanced radiation-hardened components, novel configuration and design methodologies, and software models to enhance electronic component radiation tolerance is accelerating due to the growing number of space operations. The US was the first nation to collaborate closely with many space associations and express interest in launching space exploration initiatives. Its infrastructure for testing and manufacturing, as well as a skilled population, make it simpler for the nation to carry out these tasks.

    Impact of Covid-19

    The value chain and the demand for radiation-hardened electronics in a range of applications have both been significantly impacted by COVID-19. Through the use of radiation-hardened electronic components, COVID-19 has a significant effect on satellite manufacturing. This industry, which has a limited number of suppliers, is characterised by low production volumes and a high degree of expertise. In addition, COVID-19 has impacted several countries, particularly in Europe, where the third phase of the lockdown was implemented in the first quarter of 2021, by disrupting supply chains, increasing lead times for the supply of raw materials and components, delaying the execution of contracts, and causing lockdowns. Back-end subcontractors and outside silicon foundries are also used for some of the production tasks in the sector.

    Market Segmentation

    Segmentation By Component: Global Radiation-Hardened Electronics Market is segmented into component such as Microprocessor, Memory, FPGA, and Sensors. 

    Segmentation By Application: Global Radiation-Hardened Electronics Market is segmented into application such as Space, Aerospace & Defense, and Nuclear Power Plants. In terms of income, the space sector led the Radiation Hardened Electronic Market in 2021. Radiation-hardened electronics producers are under pressure to create more durable and dependable electrical parts for space applications as a result of the expansion of ISR activities and the number of space missions.

    Segmentation By Region: Global Radiation-Hardened Electronics Market is segmented into five regions such as North America, Latin America, Europe, Asia Pacific, and Middle East & Africa. Due to the existence of rad-hard component producers, North America dominates the market for radiation-hardened electronics. A substantial growth rate is anticipated for Asia-Pacific over the forecast period due to the region's advanced manufacturing capabilities and the expanding economies of China, Japan, and India.

    Market Key Players

    Various key players are discussed in this report such as  BAE Systems PLC, Honeywell Aerospace,  Microsemi Corp., Microchip Technology Inc., Xilinx, Inc., Texas Instruments, Inc., St Microelectronics NV, and Maxwell Technologies, Inc.

    Market Taxonomy
    By Component
    • Microprocessor
    • Memory
    • FPGA
    • Sensors
    By Application
    • Space
    • Aerospace & Defense
    • Nuclear Power Plants
    By Region 
    • North America
    • Latin America
    • Europe
    • Asia Pacific
    • Middle East & Africa
    Key Questions Addressed by the Report
    • What are the Key Opportunities in Global Radiation Hardened Electronics Market?
    • What will be the growth rate from 2022 to 2027?
    • Which segment/region will have highest growth?
    • What are the factors that will impact/drive the Market?
    • What is the competitive Landscape in the Industry?
    • What is the role of key players in the value chain?
    • What are the strategies adopted by key players?


     

    Global Radiation-Hardened Electronics Market 
    1 Introduction
    1.1 Objective of the Study
    1.2 Market definition
    1.3 Market Scope
    2 Research Methodology
    2.1 Data Mining
    2.2 Validation
    2.3 Primary Interviews
    2.4 List of Data Sources
    3 Executive Summary
    4 Global Radiation-Hardened Electronics Market Outlook
    4.1 Overview
    4.2 Market Dynamics
    4.2.1 Drivers
    4.2.2 Restraints
    4.2.3 Opportunities
    4.3 Porters Five Force Model
    4.4 Value Chain Analysis
    5 Global Radiation-Hardened Electronics Market, By Component
    5.1 Y-o-Y Growth Comparison, By Component 
    5.2 Global Radiation-Hardened Electronics Market Share Analysis, By Component 
    5.3 Global Radiation-Hardened Electronics Market Size and Forecast, By Component
    5.3.1 Microprocessor
    5.3.2 Memory
    5.3.3FPGA
    5.3.4Sensors
    6 Global Radiation-Hardened Electronics Market, By Application
    6.1 Y-o-Y Growth Comparison, By Application
    6.2 Global Radiation-Hardened Electronics Market Share Analysis, By Application
    6.3 Global Radiation-Hardened Electronics Market Size and Forecast, By Application
    6.3.1 Aerospace & Defense
    6.3.2 Nuclear Power Plants
    7 Global Radiation-Hardened Electronics Market, By Region
    7.1 Global Radiation-Hardened Electronics Market Share Analysis, By Region
    7.2 Global Radiation-Hardened Electronics Market Share Analysis, By Region
    7.3 Global Radiation-Hardened Electronics Market Size and Forecast, By Region
    8 North America Radiation-Hardened Electronics Market Analysis and Forecast (2022– 2027)
    8.1 Introduction
    8.2 North America Radiation-Hardened Electronics Market Share Analysis, By Component
    8.3 North America Radiation-Hardened Electronics Market Size and Forecast, By Application
    8.4 North America Radiation-Hardened Electronics Market Size and Forecast, By Country
    8.4.1 U.S
    8.4.2 Canada
    8.4.3 Mexico
    9 Europe Radiation-Hardened Electronics Market Analysis and Forecast (2022 – 2027)
    9.1 Introduction
    9.2 Europe Radiation-Hardened Electronics Market Share Analysis, By Component 
    9.3 Europe Radiation-Hardened Electronics Market Size and Forecast, By Application 
    9.4 Europe Radiation-Hardened Electronics Market Size and Forecast, By Country
    9.4.1 Germany
    9.4.2 France
    9.4.3 UK
    9.4.4. Rest of Europe
    10 Asia Pacific Radiation-Hardened Electronics Market Analysis and Forecast (2022 – 2027)
    10.1 Introduction
    10.2 Asia Pacific Radiation-Hardened Electronics Market Share Analysis, By Component 
    10.3 Asia Pacific Radiation-Hardened Electronics Market Size and Forecast, By Application 
    10.4 Asia Pacific Radiation-Hardened Electronics Market Size and Forecast, By Country
    10.4.1 China
    10.4.2 Japan
    10.4.3 India
    10.4.4. Rest of Asia Pacific
    11 Latin America Radiation-Hardened Electronics Market Analysis and Forecast (2022 – 2027)
    11.1 Introduction
    11.2 Latin America Radiation-Hardened Electronics Market Share Analysis, By Component 
    11.3 Latin America Radiation-Hardened Electronics Market Size and Forecast, By Application 
    11.4 Latin America Radiation-Hardened Electronics Market Size and Forecast, By Country
    12 Middle East Radiation-Hardened Electronics Market Analysis and Forecast (2022 – 2027)
    12.1 Introduction
    12.2 Middle East Radiation-Hardened Electronics Market Share Analysis, By Component 
    12.3 Middle East Radiation-Hardened Electronics Market Size and Forecast, By Application 
    12.4 Middle East Radiation-Hardened Electronics Market Size and Forecast, By Country
    13 Competitive Analysis
    13.1 Competition Dashboard
    13.2 Market share Analysis of Top Vendors
    13.3 Key Development Strategies
    14 Company Profiles
    15.1 BAE Systems PLC
    15.1.1 Overview
    15.1.2 Offerings
    15.1.3 Key Financials
    15.1.4 Business Segment & Geographic Overview
    15.1.5 Key Market Developments
    15.1.6 Key Strategies
    15.2 Honeywell Aerospace
    15.2.1 Overview
    15.2.2 Offerings
    15.2.3 Key Financials
    15.2.4 Business Segment & Geographic Overview
    15.2.5 Key Market Developments
    15.2.6 Key Strategies
    15.3 Microsemi Corp
    15.3.1 Overview
    15.3.2 Offerings
    15.3.3 Key Financials
    15.3.4 Business Segment & Geographic Overview
    15.3.5 Key Market Developments
    15.3.6 Key Strategies
    15.4 Microchip Technology Inc.
    15.4.1 Overview
    15.4.2 Offerings
    15.4.3 Key Financials
    15.4.4 Business Segment & Geographic Overview
    15.4.5 Key Market Developments
    15.4.6 Key Strategies
    15.5 Xilinx, Inc.
    15.5.1 Overview
    15.5.2 Offerings
    15.5.3 Key Financials
    15.5.4 Business Segment & Geographic Overview
    15.5.5 Key Market Developments
    15.5.6 Key Strategies
    15.6 Texas Instruments, Inc.
    15.6.1 Overview
    15.6.2 Offerings
    15.6.3 Key Financials
    15.6.4 Business Segment & Geographic Overview
    15.6.5 Key Market Developments
    15.6.6 Key Strategies
    15.7 St Microelectronics NV
    15.7.1 Overview
    15.7.2 Offerings
    15.7.3 Key Financials
    15.7.4 Business Segment & Geographic Overview
    15.7.5 Key Market Developments
    15.7.6 Key Strategies
    15.8 Maxwell Technologies, Inc.
    15.8.1 Overview
    15.8.2 Offerings
    15.8.3 Key Financials
    15.8.4 Business Segment & Geographic Overview
    15.8.5 Key Market Developments
    15.8.6 Key Strategies